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tda2040 20w hi-fi audio power amplifier september 2003 pentawatt ordering number : tda2040v ? description the tda2040 is a monolithic integrated circuit in pentawatt package, intended for use as an audio class ab amplifier. typically it provides 22w output power (d = 0.5%) at v s = 32v/4 w . the tda2040 provides high output current and has very low harmonic and cross-over distortion. further the device incorporates a patented short circuit protec- tion system comprising an arrangement for auto- matically limiting the dissipated power so as to keep the working point of the output transistors within their safe operating area. a thermal shut-down system is also included. test circuit 1/13
schematic diagram pin connection thermal data symbol parameter value unit r th j-case thermal resistance junction-case max. 3 c/w tda2040 2/13
electrical characteristics (refer to the test circuit, v s = 16v, t amb = 25 o c unless otherwise specified) symbol parameter test conditions min. typ. max. unit v s supply voltage 2.5 20 v i d quiescent drain current v s = 4.5v v s = 20v 45 30 100 ma ma i b input bias current v s = 20v 0.3 1 m a v os input offset voltage v s = 20v 2 20 mv i os input offset current 200 na p o output power d = 0.5%, t case = 60 c f = 1khz r l = 4 w r l = 8 w f = 15khz r l = 4 w 20 15 22 12 18 w bw power bandwidth p o = 1w, r l = 4 w 100 khz g v open loop voltage gain f = 1khz 80 db g v closed loop voltage gain f = 1khz 29.5 30 30.5 db d total harmonic distortion p o = 0.1 to 10w, r l = 4 w f = 40 to 15000hz f = 1khz 0.08 0.03 % e n input noise voltage b = curve a b = 22hz to 22khz 2 310 m v m v i n input noise current b = curve a b = 22hz to 22khz 50 80 200 pa r i input resistance (pin 1) 0.5 5 m w svr supply voltage rejection r l = 4 w , r g = 22k w , g v = 30db f = 100hz, v ripple = 0.5v rms 40 50 db h efficiency f = 1khz p o = 12w r l = 8 w p o = 22w r l = 4 w 66 63 % t j thermal shut-down junction temperature 145 c absolute maximum ratings symbol parameter value unit v s supply voltage 20 v v i input voltage v s v i differential input voltage 15 v i o output peak current (internally limited) 4 a p tot power dissipation at t case = 75 c25w t stg , t j storage and junction temperature C 40 to + 150 c tda2040 3/13
figure 1 : output power versus supply voltage figure 2 : output power versus supply voltage figure 3 : output power versus supply voltage figure 4 : distortion versus frequency figure 5 : supply voltage rejection versus frequency figure 6 : supply voltage rejection versus voltage gain tda2040 4/13
figure 7 : quiescent drain current versus supply voltage figure 8 : open loop gain versus frequency figure 9 : power dissipation versus output power tda2040 5/13
figure 10 : amplifier with split power supply figure 11 : p.c. board and components layout for the circuit of figure 10 (1:1 scale) tda2040 6/13
note : in this case of highly inductive loads protection diodes may be necessary. figure 12 : amplifier with split power supply (see note) figure 13 : p.c. board and components layout for the circuit of figure 12 (1:1 scale) tda2040 7/13
figure 14 : 30w bridge amplifier with split power supply figure 15 : p.c. board and components layout for the circuit of figure 14 (1:1 scale) tda2040 8/13
figure 16 : two way hi-fi system with active crossover figure 17 : p.c. board and components layout for the circuit of figure 16 (1:1 scale) tda2040 9/13
figure 18 : frequency response figure 19 : power distribution versus frequency multiway speaker systems and active boxes multiway loudspeaker systems provide the best possible acoustic performance since each loud- speaker is specially designed and optimized to handle a limited range of frequencies. commonly, these loudspeaker systems divide the audio spec- trum into two, three or four bands. to maintain a flat frequency response over the hi-fi audio range the bands covered by each loud- speaker must overlap slightly. imbalance between the loudspeakers produces unacceptable results therefore it is important to ensure that each unit generates the correct amount of acoustic energy for its segment of the audio spectrum. in this re- spect it is also important to know the energy distri- bution of the music spectrum determine the cutoff frequencies of the crossover filters (see figure 19). as an example, a 100w three-way system with crossover frequencies of 400hz and 3khz would require 50w for the woofer, 35w for the midrange unit and 15w for the tweeter. both active and passive filters can be used for crossovers but today active filters cost significantly less than a good passive filter using air-cored in- ductors and non-electrolytic capacitors. in addition, active filters do not suffer from the typical defects of passive filters : - power loss - increased impedance seen by the loudspeaker (lower damping) - difficulty of precise design due to variable loud- speaker impedance obviously, active crossovers can only be used if a power amplifier is provided for each drive unit. this makes it particularly interesting and economically sound to use monolithic power amplifiers. in some applications, complex filters are not really neces- sary and simple rc low-pass and high-pass net- works (6db/octave) can be recommended. the results obtained are excellent because this is the best type of audio filter and the only one free from phase and transient distortion. the rather poor out of band attenuation of single rc filters means that the loudspeaker must oper- ate linearly well beyond the crossover frequency to avoid distortion. a more effective solution, named "active power filter" by sgs is shown in figure 20. figure 20 : active power filter the proposed circuit can realize combined power amplifiers and 12db/octave or 18db/octave high- pass or low-pass filters. in practice, at the input pins of the amplifier two equal and in-phase voltages are available, as re- quired for the active filter operation. tda2040 10/13
the impedance at the pin (-) is of the order of 100 w , while that of the pin (+) is very high, which is also what was wanted. c1 = c2 = c3 r1 r2 r3 22 nf 8.2 k w 5.6 k w 33 k w the component values calculated for f c = 900hz using a bessel 3rd order sallen and key structure are : in the block diagram of figure 21 is represented an active loudspeaker system completely realized us- ing power integrated circuit, rather than the tradi- tional discrete transistors on hybrids, very high quality is obtained by driving the audio spectrum into three bands using active crossovers (tda2320a) and a separate amplifier and loud- speakers for each band. a modern subwoofer/midrange/tweeter solution is used. pratical consideration printed circuit board the layout shown in figure 11 should be adopted by the designers. if different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the gorund return of the output in which a high current flows. assembly suggestion no electrical isolation is needed between the pack- age and the heatsink with single supply voltage configuration. application suggestions the recommended values of the components are those shown on application circuit of fig. 10. dif- ferent values can be used. the following table can help the designer. figure 21 : high power active loudspeaker system using tda2030a and tda2040 comp. recom. value purpose larger than recommended value smaller than recommended value r1 22k w non inverting input biasing increase of input impedance decrease of input impedance r2 680 w closed loop gain setting decrease of gain (*) increase of gain r3 22k w closed loop gain setting increase of gain decrease of gain (*) r4 4.7 w frequency stability danger of oscillation at high frequencies with inductive loads c1 1 m f input dc decoupling increase of low frequencies cut-off c2 22 m f inverting dc decoupling increase of low frequencies cut-off c3, c4 0.1 m f supply voltage bypass danger of oscillation c5, c6 220 m f supply voltage bypass danger of oscillation c7 0.1 m f frequency stability danger of oscillation (*) the value of closed loop gain must be higher than 24db tda2040 11/13
weight: 2.00gr pentawatt v dim. mm inch min. typ. max. min. typ. max. a 4.8 0.189 c 1.37 0.054 d 2.4 2.8 0.094 0.110 d1 1.2 1.35 0.047 0.053 e 0.35 0.55 0.014 0.022 e1 0.76 1.19 0.030 0.047 f 0.8 1.05 0.031 0.041 f1 1.0 1.4 0.039 0.055 g 3.2 3.4 3.6 0.126 0.134 0.142 g1 6.6 6.8 7.0 0.260 0.268 0.276 h2 10.4 0.409 h3 10.05 10.4 0.396 0.409 l 17.55 17.85 18.15 0.691 0.703 0.715 l1 15.55 15.75 15.95 0.612 0.620 0.628 l2 21.2 21.4 21.6 0.831 0.843 0.850 l3 22.3 22.5 22.7 0.878 0.886 0.894 l4 1.29 0.051 l5 2.6 3.0 0.102 0.118 l6 15.1 15.8 0.594 0.622 l7 6.0 6.6 0.236 0.260 l9 2.1 2.7 0.008 0.106 l10 4.3 4.8 0.17 0.189 m 4.23 4.5 4.75 0.167 0.178 0.187 m1 3.75 4.0 4.25 0.148 0.157 0.167 v4 40? (typ.) v5 90? (typ.) dia 3.65 3.85 0.144 0.152 l l1 a c l5 d1 l2 l3 e m1 m d h3 dia. l7 l9 l10 l6 f1 h2 f gg1 e1 f e v4 resin between leads h2 v5 v4 pentvme l4 0015981 outline and mechanical data tda2040 12/13
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co n- sequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information pr e- viously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or sys- tems without express written approval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners ? 2003 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia C belgium - brazil - canada - china C czech republic - finland - france - germany - hong kong - india - israel - ital y - ja- pan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states www.st.com tda2040 13/13

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